Description
| The Thermal Imaging Enhancement System for the ILX-LR1 comprises four essential components: a computer module, a USB cable, a data cable, and a thermal camera module.
The complete system installs and can be removed in minutes, and offers a non-invasive, seamless integration with the Sony Airpeak S1. Once installed, full and intuitive control of both the thermal and visual imaging sensors is possible through the Airpeak Flight App. |
Specifications
General– Total system weight: 150g – 100% NDAA compliant – Selective Laser Sintering and Carbon Fiber Enclosure Features– Easily switch between thermal, visual, and Picture-in-Picture camera views – Simultaneously capture thermal and visual images with a single button press – Full control over thermal sensor enhancements, including Palettes, Isotherms, and Spot Temperature Statistics |
Thermal Core– FLIR Boson 640 X 480 18MM 24° HFOV (Radiometric Version) – Sensor technology: 12 µm pixel pitch uncooled microbolometer – Spectral Band: LWIR 7.5 µm – 13.5 µm – Maximum effective frame rate: 60Hz – Thermal sensitivity: <50 mK |
Computer– Processor: Quad Core 1.6GHz ARM® Cortex™-A53 – Thermal Camera Storage: SDcard, Max capacity 32 GB |
